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GIGABYTE B560M AORUS PRO AX INTEL B560 EXPRESS CHIPSET MOTHERBOARD MICRO ATX FORM FACTOR LGA1200 ADVANCED THERMAL DESIGNB560M AORUS PRO AXKey FeatureSupports 11th and 10th Gen Intel Core Series ProcessorsDual Channel Non-ECC Unbuffered DDR4, 4 DIMMsDirect
GIGABYTE B560M AORUS PRO AX INTEL B560 EXPRESS CHIPSET MOTHERBOARD MICRO ATX FORM FACTOR LGA1200 ADVANCED THERMAL DESIGN
B560M AORUS PRO AX
Key Feature
* Actual support may vary by CPU.
DIRECT POWER DESIGN
B560M AORUS motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard’s most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.
ADVANCED THERMAL SOLUTION
B560M AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.
PERFORMANCE
With the best quality components and GIGABYTE R&D design capability, the B560M AORUS is a true beast among motherboards.
NEXT GENERATION CONNECTIVITY
High Quality Onboard Audio Design
Delivers high quality sound resolution and sound expansion to create the most realistic sound effects for professional gamers.
The below photos are for reference only.
Audio Noise Guard with
LED Trace Path Lighting
High-End Audio
Components
DEFINITIVE AESTHETICS
B560M AORUS PRO AX features RGB FUSION 2.0 and offers users the option to control onboard, external light strips, and/or AORUS devices with RGB/ Addressable RGB LEDs to make their PC more unique and stylish.
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the B560M AORUS motherboard and reinforce every slot to make each of them solid and durable.
GIGABYTE BIOS & APP CENTER
Good software goes hand in hand with perfect hardware. GIGABYTE motherboard bundled several useful and intuitive software to help users to control every aspect of motherboard.
| Specifications | |
|---|---|
| Audio | Realtek Audio codec High Definition Audio 2/4/5.1/7.1-channel |
| Chipset | Intel B560 Express Chipset |
| Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm |
| I/O Connectors | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 1 x water cooling CPU fan header 3 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 6 x SATA 6Gb/s connectors 2 x M.2 Socket 3 connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 1 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 2 x Thunderbolt add-in card connectors 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x serial port header 1 x Clear CMOS jumper 1 x Q-Flash Plus button *All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W. |
| Integrated CPU Graphics | |
| LAN | Intel2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit) |
| Memory/Type/Bus/Max. | 11th Generation Intel Core i9/i7/i5 processors: Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200(O.C.) / 3000(O.C.) / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules 10th Generation Intel Core i9/i7 processors: Support for DDR4 2933/2666/2400/2133 MHz memory modules 10th Generation Intel Core i5/i3 /Pentium/Celeron processors: Support for DDR4 2666/2400/2133 MHz memory modules 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer “Memory Support List” for more information.) |
| Misc. | |
| Other I/O Connectors | |
| PCI Slots | 1 x PCI Express x16 slot, running at x16 (PCIEX16) * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot. (The PCIEX16 slot conforms to PCI Express 4.0 standard.)* *Supported by 11th Generation processors only. 1 x PCI Express x16 slot, running at x4 (PCIEX4) 1 x PCI Express x1 slot (The PCIEX4 and PCIEX1 slots conform to PCI Express 3.0 standard.) |
| Processor Support | |
| Raid | |
| RAM Type/Bus/Max. | |
| Socket | Intel LGA1200 |
| Storage Interface | CPU: 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU)* * Supported by 11th Generation processors only. Chipset: 1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB) 6 x SATA 6Gb/s connectors * Refer to “1-7 Internal Connectors,” for the installation notices for the M.2 and SATA connectors. Intel Optane Memory Ready |
| USB Ports | Chipset: 1 x USB Type-C port on the back panel, with USB 3.2 Gen2x2 support 1 x USB 3.2 Gen2 Type-A ports (red) on the back panel 2 x USB 3.2 Gen1 ports on the back panel 2 x USB 2.0/1.1 ports on the back panel Chipset+USB 3.2 Gen 1 Hub: 1 x USB Type-C port with USB 3.2 Gen1 support, available through the internal USB header 2 x USB 3.2 Gen1 ports available through the internal USB header Chipset+ 2 USB 2.0 Hubs: 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers) |
| Video Output | |
| Warranty | |
| Weight |
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